This is an archive site for ERPem. For more up to date information about research partnership work, see Edinburgh Research Partnership in Engineering (ERPe) and Maxwell Institute for Mathematical Sciences


Full range of processing equipment for IC semiconductor and MEMS fabrication within a class 10 cleanroom environment

Inductively coupled plasma etcher for silicon deep etch (class 10 cleanroom)

Lithography - double sided aligner, projection stepper, e-beam (class 10 cleanroom)

Electroplating: Two separate tanks for different electroplating solutions. DC and pulse-plating are possible. Suitable for wafer with a diameter up to 20 inches

Plasma enhance vapour deposition, sputtering, CMP, wafer dicing, bonding, packaging (class 10 cleanroom)

White light interferometer from Zygo with a resolution in vertical direction of 1 nanometer (class 1000 cleanroom)

Physical vapour deposition - High vacuum electron beam evaporator suitable to deposit 4 different materials (class 1000 cleanroom)

Karl Suss FC-6 Flip-Chip-Bonder (class 1000 cleanroom)

Optical assembly cleanrooms (class 100 – 10,0000), cryogenic test and flexure testing facilities (10 Tonnes max)

Chip repair, Analytical

  • Field Emission SEM (Philips XL40FEG)
  • EDX analytical FESEM (Hitachi S4500II)
  • FIB Workstation (FEI FIB200)
  • AFM (Digital Instruments 5000)


NANO-INDENTATION (including nano-scratch, nanowear, and AFM)

Raman Spectrometry



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