Capabilities

Highlights

• Post-processing CMOS Foundry Wafers
• Integration of LIGA with CMOS
• Integration of MEMS and IC Technology
• Co-location of IC Design with IC Technology
• Optically patterning of 0.35 micron line - spaces on 22 x 22mm chips
• Fabrication of membranes, cantilevers
• 200, 150, 100 and 75mm wafer processing capability
• 250m2 Class 10) and 250m2 100-1000 cleanrooms for micro/nanofabrication and optical assembly
• Cryogenic test facilities
• Flexure testing facilities (10 Tonnes max)

Full CMOS processing

• Lithography - 0.35 micron photo (75mm - 200mm), e-beam
• Layer Deposition - PECVD, LPCVD, sputtering, physical vapour deposition
• Reactive Ion Etching - Chlorine, Fluorine chemistries
• Chemical Mechanical Polishing

Analytical Tools

• Microscopy - SEM, TEM, AFM
• Focussed Ion Beam
• Interferometry
• Full Electrical Test Suite
• Spectroscopic Ellipsometer
• Raman Spectrometry
• Nano-indentation
• Network analyzer

Software Tools

• Agilent IC-CAP – Electrical
• Synopsis (Process and Device simulation)
• ANSYS - Mechanical
• ANSYS - Fluidics
• COVENTOR - MEMS
• Cadence Design Suite
• FEMLAB®
• ABAQUS
• SolidWork

MEMS + post processing

• Double Sided Alignment
• Deep Reactive Ion Etching
• XeF2 Etch Release
• Critical Point Drying
• Surface Treatment
• Electroplating
• Anodic Bonding
• Wafer Dicing
• Laser Machining
• LIGA

Materials

Conductors

• Aluminium, Gold, Titanium, Nickel, Tantalum, Copper, Silver, Titanium Nitride, Tantalum Nitride, Carbon Nanotubes
  

  Dielectrics

• Silicon Oxide, Parylene, Silicon Nitride, Teflon, PDMS
  

  MBE

• CdSe, ZnSe, MgS, ZnMgSSe etc